Most teams know they need a new GPU or storage chassis.
Very few really think through the full journey from RFQ 에 mass production until it’s a bit late.
This article makes one clear point:
If you want a stable launch, you can’t treat the OEM/ODM server case timeline as a black box. You need a clear roadmap, and a partner like IStoneCase who actually lives inside that roadmap every day.
We’ll walk through the usual phases for an OEM/ODM 서버 PC 케이스 project, add real-world use cases, and show where an expert chassis maker quietly saves you months of chaos.
RFQ for OEM/ODM Server Case, GPU Chassis and Storage Chassis
RFQ Content and OEM/ODM Server Case Requirements
The story usually starts in a data center or algorithm team:
- AI cluster is thermal throttling.
- Old 컴퓨터 케이스 서버 can’t handle high-density GPUs.
- New storage node needs better cable management and tool-less rails.
So you draft an RFQ and send it out.
A solid RFQ for a 서버 랙 PC 케이스 or GPU chassis normally includes:
- Target platforms: motherboard form factor, GPU count, PSU type.
- Mechanical envelope: height (1U/2U/4U), depth, rail type.
- Thermal limits: max CPU/GPU TDP, room conditions, airflow direction.
- Compliance needs: safety, EMC, environmental.
- Volume and ramp: first PO, target ramp curve, buffer plan.
- Service model: hot-swap requirements, slide rails, front access, etc.
A weak RFQ says only “need 4U GPU box, good cooling” and expect vendor to guess everything.
That guess work later becomes design change, re-spin, and schedule pain.
에서 IStoneCase, we usually push back a bit here.
Not to be annoying. Just because we know if the RFQ is fuzzy, the whole project will drift.
OEM vs ODM for Server PC Case and Computer Case Server Projects
Here’s the second big decision: OEM or ODM.
- OEM style
- You already have a 3D model.
- Your mechanical team controls the spec.
- You need a factory to industrialize, do DFM, and build.
- You want strict control over the 컴퓨터 케이스 서버 레이아웃.
- ODM style
- You know the workload and business goal.
- You don’t really want to design sheet metal by yourself.
- You reuse a proven GPU 서버 케이스 또는 랙마운트 케이스 platform, then customize front panel, drive cage, airflow, rails and so on.
예를 들어
- A cloud provider with strong in-house ME team may treat IStoneCase as an OEM partner for a fully custom ATX 서버 케이스.
- A mid-size IT service company may go ODM: “We need 8-GPU, front I/O, short depth. You help build the full thing.”
Same timeline, different risk profile:
- OEM: more risk on your side if the design is not manufacturable enough.
- ODM: more design load on IStoneCase, but you stand on our existing platforms and test data.
Honestly, for many 서버 PC 케이스 projects under time pressure, ODM with heavy customization is the more realistic play.
EVT, DVT and PVT for Server Rack PC Case and ATX Server Case
Once RFQ is clear and the engagement model is set, the project walks through the classic hardware gates:
Engineering Validation Test (EVT) for Server Rack PC Case
EVT answers a simple question:
“Does this thing basically work the way we imagine?”
For a 서버 랙 PC 케이스 or GPU chassis, that means:
- Boards fit, no mechanical clash with heatsinks or cables.
- Airflow goes where it should, not just leaking out.
- Noise level stays under your internal target.
- Basic assembly is possible without three extra hands.
A typical EVT batch is small.
Maybe a few dozen units built from near-final metal, sometimes with quick tweaks.
This phase takes some weeks, and it always feels slower than you want, because:
- Tooling needs to be tuned.
- Minor rework and drilling still happen.
- First thermal tests almost always show “one hot spot we didn’t like”.
If a vendor tells you “no problems, EVT is always perfect”, that’s a bit suspicious.
Design Validation Test (DVT) and Compliance for Server PC Case
DVT asks:
“Can this 서버 PC 케이스 survive real-life abuse and still pass lab tests?”
Here you usually:
- Lock materials and surface finish.
- Run vibration, drop, sometimes shock testing.
- Do EMI/EMC work with full system inside the chassis.
- Validate storage cages, latches, doors after repeated use.
This is also where data center folks start asking “can we put this box in mixed rack with old gear, any funny airflow issues?”.
If your chassis partner understands data hall reality (front-to-back pressure, cable jungle, hot aisle / cold aisle), the DVT loop becomes much cleaner.
Production Validation Test (PVT) and Ramp for ATX Server Case
PVT is the dress rehearsal:
“If we push this through the real line, can we hit yield and takt time?”
For an ATX 서버 케이스 or NAS chassis, in PVT you:
- Run on near-final production line.
- Use real fixtures, real work instructions, real QA checkpoints.
- Track assembly time, cosmetic defects, rework rate.
- Produce the “golden sample” that future batches will copy.
This is also where you catch hidden issues like:
- One screw that always strips.
- A cable route that slows the line.
- A latch that fails after many cycles.
If PVT looks good, mass production is usually… kind of boring.
Boring is good here.
Typical OEM/ODM Server Case Project Timeline Table
Every project is different, but the journey tends to rhymes.
Below is a reference flow you can adapt for your own planning with IStoneCase.
Time ranges are rough. They depend on complexity, review speed, and how many times spec change mid-way.
| Phase | Main Output | Rough Duration (Typical Range) | Notes for OEM/ODM Server Case Projects |
|---|---|---|---|
| RFQ & Vendor Alignment | Clear RFQ, clarified spec, first quotation, chosen partner | Around 1–2 months | The more clear you are on workload, rack layout and service model, the more stable the rest of the schedule. |
| Concept & Engagement (OEM vs ODM) | Confirm OEM/ODM mode, basic mechanical concept, NRE and tooling scope | ~2–4 weeks | Locking rack height, depth, GPU count and airflow direction early saves many re-spins later. |
| Detailed Design & DFM | Final 3D/2D, BOM draft, DFM report, thermal and mechanical review | ~3–6 weeks | For GPU cases, thermal budget and cable routing usually drive the structure more than “nice look”. |
| Tooling Build & EVT Samples | First tools, small EVT batch, basic functional and thermal sign-off | A few to several weeks | Expect at least one loop of “tune the tool, tweak the vent holes, adjust bracket”. This is very normal. |
| DVT & Compliance | Larger batch with close-to-final parts, reliability and compliance testing | ~1–2 months | Good DVT avoids nasty surprises when you ship to different regions and power standards. |
| PVT & Line Tuning | Trial production, golden sample, final WI and QA checkpoints | ~3–6 weeks | Focus is on yield, assembly time and cosmetic quality. Good jig design pays off here. |
| Mass Production & Ramp | Stable output, rolling forecast and continuous improvement | Ongoing | At this stage you care more about supply chain, buffer stock and ECO control than pure design. |
You don’t need to copy this table 1:1.
Use it as a sanity check: if someone claims “custom high-density GPU chassis from RFQ to MP in three weeks”, you know something not real here.
How IStoneCase Helps You De-Risk the OEM/ODM Server Case Timeline
Now, where does IStoneCase fit in all this?
We position ourselves as:
“The world’s leading GPU/server case and storage chassis OEM/ODM solution manufacturer”
In practice that means a few concrete things for your timeline:
- Platform-based customization
- Full product range that actually matches your fleet
- Data centers and algorithm centers mix a lot of gear: GPU nodes, storage, small edge boxes.
- We cover 서버 랙 PC 케이스클래식 서버 PC 케이스, 컴팩트 ITX 케이스, NAS 장치, 벽걸이 케이스심지어 섀시 가이드 레일.
- This makes it easier to keep mechanical language, rails and maintenance style consistent across your racks.
- DFM and thermal thinking from day one
- We don’t just ask for pretty CAD. We ask “how will this be racked, serviced, and cooled in a dusty real room, not in PPT”.
- For AI and HPC loads, our team checks GPU spacing, ducting, and fan strategy early.
- Yes, sometimes we say “this design is nice but don’t will cool, let’s move this fan wall”.
- Bulk, wholesale and long-term view
- Most of our customers are not buying one or two units.
- They are data centers, large and mid businesses, IT service providers, database platforms, research labs, and even hardcore enthusiasts.
- So we plan for volume: proper ECO process, spare part strategy, and second-source thinking.
- Real-world service pain points
- Tool-less drive cages that actually last.
- Rails that don’t stick when the rack is a bit twisted.
- Simple access for dust filter cleaning.
- These feel small, but they add up to lower downtime and less angry midnight calls.
Wrapping Up: Make the Timeline a Tool, Not a Surprise
If you remember only three things from this article, let it be these:
- Treat the RFQ as design phase zero.
The more clear the RFQ for your 서버 PC 케이스 또는 컴퓨터 케이스 서버, the smoother everything after. - Use EVT/DVT/PVT on purpose, not by accident.
These gates aren’t red tape. They’re how you burn down risk before you ship to real customers. - Pick an OEM/ODM partner who lives this timeline daily.
With IStoneCase you don’t just get a metal box.
You get a team that understands racks, airflow, rails, service, wholesale, and long-term fleet management.
The project will still hit some bumps – every hardware program does.
But with a clear RFQ → EVT → DVT → PVT → MP roadmap and the right chassis partner, those bumps stay inside the plan instead of blowing up your launch.
